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ASAHITEC's metal masks, laser-processed according to your configuration
requirements,
can realize high-stability, high-precision solder printing on printed
circuit boards, etc.
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Opening
diameter ：φ0.150ｍｍ
Board thickness：0.040ｍｍ |
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↑Before processing
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↑After processing
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Can process with the hole diameter precision
of within ±3μm.
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Due to high pitch precision, we can provide
masks with comprehensively high
configuration precision.
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Due to extremely
smooth processing surface and high dimensional precision, the solder
applied volume can be uniform and stable. At your request, we can
add F2 processing (special secondary processing) to further smooth
the processing surface.
| we
are also handling etching metals masks, additive metal masks,
etc., |
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| Item |
| Mask material |
SUS-３０４ |
| Max. processing area |
６００mm×６００mm |
| Max. processing metal thickness |
０.４００mm |
| Opening precision |
Within ±３μm (Metal thickness ５０μm, round hole) |
| Pitch dimensional precision |
Within ±１０μm (per pitch ２００μm, round hole) |
| Min. hole diameter |
φ２０μm |
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Solder resin filling
Surface mounting of electronic
parts
Bumping on semiconductors
Water level CSP bumping |
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| Contact eigyou@asahitec-j.co.jp |
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